Wall-assembled

Assembly Method

The wall-assembled Industrial Intelligent Computer is designed for space-constrained applications requiring permanent mounting, such as control cabinets, equipment enclosures, or vertical surfaces. Standard assembly procedure is as follows:

Equipment and Assembly Environment Inspection

Prior to assembly:

• Confirm location provides adequate ventilation clearance (>10cm from walls/obstructions)
• Verify mounting surface structural integrity to withstand 17kg device weight with 5G vibration tolerance
• Maintain ≥5-10cm service clearance for thermal management and maintenance access

Bracket Assembly

1. Select Mounting Hardware:
   Use VESA 75/100 compliant bracket or proprietary mount kit matching IP54-rated enclosure
2. Mark Drilling Coordinates:
   Transfer device's M4 mounting hole pattern to surface using template
3. Drill and Secure Anchors:
   For concrete/steel surfaces:
   • Drill Ø6mm holes at markings
   • Install M4 expansion anchors with 0.8Nm torque

Device Assembly

1. Bracket-to-Surface Assembly:
   Secure bracket using M4×12mm stainless steel screws (8.8 grade)
2. Device-to-Bracket Assembly:
   Engage device with bracket, apply 1.2Nm torque to four corner fasteners

Cable Integration

1. Port Connection Sequence:
   ① Power → ② Ethernet → ③ I/O → ④ Display cables
2. Strain Relief Implementation:
   • Maintain ≥25mm bend radius on all cables
   • Install cable clamps within 100mm of connectors
   • Secure bundles with UV-resistant nylon ties (max 150mm spacing)

Post-Assembly Verification:

• Confirm <0.5mm bracket deflection with 20N force
• Validate all connectors achieve IP54 seal rating
• Perform 48h thermal cycle test (-10℃ to 50℃)